FENGHONG

Adhesives and Sealants

Applications

Adhesives and Sealants

Fenghong Company's polyamide wax micro-powder products are widely used in moisture-curing MS sealants, solvent-based sealants, and structural adhesives, possessing excellent thixotropy control, anti-sagging, anti-collapse, and dispersion stability performance. The products can replace traditional additives such as silica dioxide, with better cost control and environmental protection, suitable for multiple adhesive fields such as automotive manufacturing, building sealing, and industrial assembly.

01

Rheology Modification for MS Sealants

Rheology Modification for MS Sealants

Fenghong Company's PA series polyamide wax powders (such as PA-7100, PA-7200) are specially developed for low-temperature moisture-curing MS sealants and single-component sealant formulations, with 100% activity, high cost-effectiveness, and excellent storage stability.

The products can achieve efficient activation in the range of 30~90°C, forming crystalline fiber network structures, greatly improving the thixotropy, anti-sagging, and anti-collapse performance of the system, making them excellent alternatives to silica dioxide.

Suitable Products

  • PA-7100
  • PA-7200
02

Anti-sagging and Anti-sedimentation for Solvent-based Adhesives

Anti-sagging and Anti-sedimentation for Solvent-based Adhesives

PA-8680 and PA-8700S products have good dispersibility and thermal shear response, able to form stable network structures in medium-low polarity solvent systems, significantly improving the anti-sagging and anti-sedimentation properties of colloids.

The products are suitable for resin systems such as acrylic, unsaturated polyester, and chlorinated rubber, with good rheology control and formulation compatibility in industrial structural adhesives and high-viscosity bonding materials.

Suitable Products

  • PA-8680
  • PA-8700S

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